• 各族群众乐享假日:粽叶飘香 歌舞传情 2019-08-12
  • 人民网评:涉及群众利益的事,必须“马上就办” 2019-08-12
  • 2018世界杯进入倒计时  莫斯科举行大型灯光秀 2019-07-31
  • 组图:第98届全国糖酒会开幕 异域美酒飘香全场 2019-07-12
  • 佛山通报“母女公交站身亡原因”:广告灯箱电线破损漏电 2019-07-04
  • 注意了!报考这个专业须先参加面试 2019-07-04
  • 湖州林城:多渠道搭建“双禁”宣传平台 2019-06-29
  • 西川:把自己活成一件作品西川作品 2019-06-12
  • 人生就是不断在告别,但请晚点再离开我 2019-06-12
  • 一直在提速降费 为何手机用户话费不降反升? 2019-06-09
  • 端午节 收艾草(组图) 2019-06-09
  • 梁天女儿进军电影圈 呼吁父爱的处女作《让我怎么相信你》8月上映  2019-06-08
  • 探访玉麦守边人(新时代·面孔) 2019-06-07
  • 乡村振兴,上海这些特色小镇如何亮出名片 2019-06-07
  • 政府拆迁和商业拆迁有什么不同?当时错信了奸商,懊悔知道晚了! 2019-06-06
  • 设为首页 设为首页 加入收藏 加入收藏 网站地图
    [请登陆][免费注册]
    搜 索
    您的位置 :首页 技术 SEMI CHINA技术委员会
    SEMI CHINA技术委员会
    SEMI CHINA技术委员会

    Name

    姓名

    Title

    Company

     Jintie Li

      李金铁

      Director, Technical Support

      Advantest

      Ruiping Wang

      王瑞萍

      Senior Director of Technology

      AMAT China

      Ken Wu

      伍强

      Field Application Manager, Lithography

      ASML

      Qingyuan Han

      韩清源

      Principal Scientist & Technology Manager, Asia

      Axcelis Technologies

      KuoChun Wu

      吴国俊

      Asia Pacific R&D Director

      Cabot Microelectronics

      Ran Liu

      刘冉

      Professor

      复旦大学

      Steve Yang

      TD Vice President

      GSMC

      S W Ricky Lee

      李世玮

       Director, EPACK Lab/CAMP

      香港科技大学(HKUST)

      Qinghuang Lin

     林庆煌

      Research Staff Member

      IBM Watson Research Centre

     Teng Gao

      高腾

      Business Development Manager

      IMEC

      Tianchun Ye

      叶甜春

      Deputy Director & Professor

      中科院微电子所

      Michale Wang

      汪晓辉

      TD Program Manager

      Intel

      Albert Yue

      余伟良

      Product Manager

      Kulicke & Soffa

      Chanpin Chong

      张赞彬

      GM, Strategic Business Dept

      KLA-Tencor China

      Jinrong Zhao

      赵晋荣

      Vice President

      北方微电子

      Jason Tian

      田晓明

      Director of Technology

      Novellus

      David P. Huang

      黄丕成

      Director of R&D

      Praxair

      Dennis Chun Ta Chen

      陈俊达

      GM, RHEM CMP Technologies

      Rohm and Haas

      Hanming Wu

      吴汉明

      Deputy Director

      SMIC

      Hans Xiao

      肖汉中

      Senior Director

      TEL

      Kevin Xia

      夏克金

      Service Support Manager

      Verigy

      Deren Yang

      杨德仁

      Deputy Director & Professor

      浙江大学

     

    SEMI CHINA技术委员会成员名单介绍(按公司名称排序,截止到2007年11月30日)
     
    Li JinTie 李金铁
    Director, Technical Support Department
    Advantest (Suzhou)
     

    Mr. Li JinTie has nearly 10 years experience in advantaged semiconductor test area. He joined ADVANTEST China as Technical Director since 2004 in charge of Technical Support Department for testing application & customer support.

    Prior to joining ADVANTEST China, Li jintie had 6 years R &D experience in ADVANTEST Japan on semiconductor testing technical and testing solution development.

    Li jintie received Bachelor Degree in Applied Chemical Engineering from Tianjing University. He also studied in Electrical Engineering field in Zhejiang University for 2 years. He received a Master Degree in Electrochemical Synthesis field from the Yamanashi University, Yamanashi, Japan. The experience of work in Japan makes him precise, creativeness and even speaks fluent Japanese.

    Dr. Ruiping Wang王瑞萍
    Sr. Technology Director
    Applied Materials China
     

    Dr. Ruiping Wang has been a Senior Director of Technology at Applied Materials China for over 5 years with the responsibility of leading the technical group, as well as being the Deputy General Manager for SMIC account business unit in Applied Materials China.

    Prior to joining Applied Materials China in 2002, Dr. Wang has worked in the Dielectric Etch Product Group in Applied Materials Inc in US for 7 years, during which Dr. Wang has filed 14 US patents. Before that, Dr. Wang has worked for Catalytica Inc. in Sunnyvale California for 2 years as a fellow chemist from 1993-1995.

    Dr. Wang received her Ph.D degree in Solid State Physics in 1991 and worked as a postoc with Professor Arthur W Sleight on Solid State Chemistry, in 1991-1993, in Oregon State University, during which Dr. Wang has published 18 technical papers.


    Dr. KuoChun Wu,吴国俊
    Director of Technology Development
    Cabot Microelectronics
     

    Dr. KC Wu has served as Director of Technology development in Cabot Microelectronics since 2007. Prior to that, Dr. Wu held senior research and development management and technology positions at Ultratech, Semiconductor Manufacturing International Corporation (SMIC), Mosel-Vitelic, and Applied Materials. Dr. Wu holds a Ph.D. in Mechanical Engineering from Massachusetts Institute of Technology (M.I.T), and is currently studying an Executive M.B.A. program in China Europe International Business School (CEIBS) in Shanghai.


    Prof. Ran Liu, 刘冉
    Professor/Deputy Director
    Micro/Nanoelectronics Science & Technology Platform
    Fudan University
     

    Dr. Ran Liu is a Changjiang Professor at Fudan University. Concurrently, he is the Deputy Director of the “Micro/Nanoelectronics Science and Technology Innovation Platform”, the only IC related R&D platform under Nation’s “985 Project”.

    Dr. Liu received his B.S. Fudan University in 1982, his M.S. from Shanghai Institute of Technical Physics in 1985, and his Ph.D. from Max-Planck-Institute for Solid State Research, Germany, in 1990.

    Prior to joining Fudan University, Dr. Liu worked for over 8 years at Motorola and was actively involved in numerous materials/device development, including high-k gate dielectrics, low-k/Cu interconnects, SiGe:C/Si HBT, strained Si channel, PDSOI and FDSOI CMOS, Si-dots nonvolatile memory, MRAM, and FRAM, and development of products related to wireless communication, consumer and automotive electronics.

    Prior to his employment at Motorola, Dr. Liu was a research scientist at the University of Illinois at Urbana-Champaign, the University of Maryland, and the National Institute of Standard and Technology for about 6 years.

    Prior to his employment at Motorola, Dr. Liu was a research scientist at the University of Illinois at Urbana-Champaign, the University of Maryland, and the National Institute of Standard and Technology for about 6 years.

    Dr. Liu is also an adjunct professor at Arizona State University in United States and a visiting professor at Shanghai Institute of Technical Physics of Chinese Academy of Sciences.


    Dr. Steve Yang
    Vice President, Technology Development
    Grace Semiconductor Manufacturing Corporation (GSMC)
     

    Dr. Steve Yang is the Vice President of Technology Development (TD) of Grace Semiconductor Manufacturing Corporation (GSMC). His responsibility is for Technology Development activities include Logic Technology, High Voltage & Power Management Technology and Advance Process Development.

    He received his Ph.D. degree in Electrical Engineering from University of Texas at Austin in 1985 and then joined to California Institute Technology (CIT) as a Research Fellow at Electrical Engineering Department. Dr. Yang became an Assistant Professor of Electrical Engineering at Mississippi State University. In 1988, He joined the Intel as Sr. process development engineer. In 1995, Dr. Yang joined to TSMC as Deputy Director of Technology. In 2003 Dr. Yang joined 1st Silicon as VP of Technology. He is response for technology development including Logic, Mixed Signal, High Voltage, Flash and e-Flash etc technologies.


    Shi-Wei Ricky Lee, Ph.D., 李世玮
    Director, EPACK Lab/CAMP
    Center for Advanced Microsystems Packaging
    Hong Kong University of Science and Technology
     

    Dr. Ricky Lee has been Director of Electronic Packaging Laboratory (EPACK Lab) at the Hong Kong University of Science and Technology (HKUST) since 2000. Dr. Lee is in charge of research and development, education and training, industrial services and liaison. In addition to the EPACK Lab directorship, he has been a faculty member in the Department of Mechanical Engineering at HKUST since 1993. His R&D activities cover wafer level chip scale packaging, 3D packaging, LED packaging, through silicon vias and high density interconnects, lead-free soldering and solder joint reliability.

    Dr. Lee received a Ph.D. degree in Aeronautical and Astronautical Engineering from Purdue University, West Lafayette, Indiana, U.S.A. and a M.S. degree in Engineering Mechanics from Virginia Polytechnic Institute & State University, Blacksburg, Virginia, U.S.A. He has substantial publications in international journals and conference proceedings. He also co-authored three technical books. Furthermore, he serves as Editor-in-Chief of IEEE Transactions on Components & Packaging Technologies and sits on the Editorial Advisory Board of two other international journals. Dr. Lee is very active in professional societies and international conferences. He is Fellow of Institute of Electrical & Electronics Engineers (IEEE), Fellow of American Society of Mechanical Engineers (ASME), and Fellow of Institute of Physics (IoP). He is also elected Distinguished Lecturer of IEEE Components, Packaging & Manufacturing Technology (CPMT) Society.


    Dr. Qinghuang Lin,林庆煌
    Research Staff Member
    IBM T. J. Watson Research Center
     

    Dr. Qinghuang Lin is a Research Staff Member at IBM T.J. Watson Research Center in Yorktown Heights, New York, USA. He has more than 10 years of experience in the semiconductor industry, all with IBM. He has held a variety of positions in semiconductor research, development, engineering and technology strategy for IBM's 512 MBit and 1 GBit DRAM technologies as well as IBM’s 0.25 um to 32 nm CMOS technologies. A frequent organizer and speaker of professional conferences, Dr. Lin is the editor of 2 books and 2 conference proceedings volumes and the author and co-author of over 50 technical papers. Dr. Lin has more than 25 issued and pending US patents. He is a recipient of 7 IBM Invention Achievement Awards. In 2002, he received an IBM Research Achievement Award for “invention, development and implementation of 248 nm bilayer resist technology in manufacturing.” Dr. Lin was also a member of the IBM team that helped win 2004 US National Medal of Technology -- the highest honor awarded by the President of the United States to America’s leading innovators.

    A member of AAAS, ACS, MRS and SPIE, Dr. Lin currently serves on the Materials Secretariat of the American Chemical Society (ACS) and the Executive Committee of the American Chemical Society: Polymeric Materials Science and Engineering division. He also served on the Executive Committee of the SPIE Advanced Lithography Symposium and is the past chairman of the SPIE Resist Conference. In addition, he is a member of two engineering honor societies: Tau Beta Pi and Alpha Sigma Mu. Dr. Lin received his B.E. and M.S. degrees from Tsinghua University, Beijing, China and his Ph.D. degree from the University of Michigan, Ann Arbor, Michigan, USA. He was a post-doctoral fellow at the University of Texas at Austin prior to joining IBM.


    Dr. Teng Gao, 高腾
    Asia Liaison Manager
    IMEC
     
    Teng Gao, Ph.D. has been Asia Liaison Manager position at IMEC for 7 years with responsibility of business development in Asia, which includes marketing, contract negotiation, and project coordination for technology transfer, technology cooperation and training.

    Teng Gao received a E.E. Master degree from Katholieke Universiteit Leuven (ESAT), Leuven, Belgium and a Ph.D. degree in Semiconductor from Katholieke Universiteit Leuven (IMEC), Leuven, Belgium. He is author or co-author of more than 20 refereed technical publications.


    Michael Wang, 汪晓辉
    Project Manager
    Project Manager
    Intel
     

    Michael Wang, Ph.D. has been pathfinding integrator at FPTD Intel for one year. Michael’s responsible for flash memory related product packaging technology exploration, especially for cellular products. He has developed spacerless films to replace the silicon spacer for stack package height reduction. Prior to this position, Michael was the Intel Assembly TD at Shanghai material group manager since 2004.

    Prior to joining Intel Company, Michael was a research fellow at National Institute of Standards and Technology at Maryland, USA. During his 2 years at NIST, Michael has worked on photo resist dissolution fundamentals through combinational method and advanced technologies such as neutron scattering.

    Michael received a Ph. D degree in polymer chemistry and physics from the Chinese University of Hong Kong. His Ph. D thesis was about the polymer phase transition study by light scattering.

    Zhao Jinrong赵晋荣
    Executive Vice President
    Beijing North Microelectronics Co.,Ltd(北方微电子)
     

    Mr. Zhao Jinrong has been Vice President at North Microelectronics Company since 2003 with participating and contributing to the development and evolution of corporate vision, strategy, goals and objectives and overseeing their executions and implementation, directing divisions of Sales, Marketing, purchasing, manufacturing, QA&QC and IP.

    Prior to joining North Microelectronics Company, Zhao was Vice President for Beijing Sevenstar Huachuang Electronic Co., Ltd. During his ten years at Sevenstar. Zhao spent time directing divisions of Sales & Marketing and product strategy planning.

    Zhao received his Bachelor Degree in Mechanics & Electronics field from Xi’an Science & Technology University, and MBA from the Capital University of International Business &Economics in Beijing. Mr. Zhao has been awarded for his outstanding contributions in Programs for Science and Technology Development by China government.

    Jason Tian, 田晓明
    Director of Technology
    Novellus Systems
     

    Jason Tian has been Director of Technology position at Novellus Systems, Inc. since September, 2006. Jason is responsible for Novellus China region technology and business development. Jason joined Novellus in December 1994. He has held various process development and management positions at Novellus San Jose, CA and Novellus Tualatin, OR. Jason holds a bachelor's degree in Electron Physics from South China Institute of Technology and a master's degree in Electrical Engineering from Northeastern University in Boston, MA, and has completed his Ph.D. coursework in Electrical Engineering at Northeastern University in Boston, MA.

    Throughout his employment with Novellus, Jason has gained in-depth knowledge of Novellus' PECVD, HDP and Tungsten technologies and has earned the trust and respect from Asia customers. Jason is a key contributor to Novellus’ worldwide success in PECVD FSG and N2 free ARL businesses. Jason has authored or coauthored more than 20 publications and several invited speaking engagement, including international symposiums. He had 8 US patents. Jason’s research efforts include the development and characterization of low-k dielectric and low-k SiC materials.


    Dr. David Huang, 黄丕成 博士
    Praxair Inc,Director of CMP R&D
     

    Dr. David Huang is currently working for Praxair as the Director of CMP R&D. He has more than 10 year experience in semiconductor manufacturing CMP process / consumable / integration / management from Intel (computer chip maker), Seagate (hard drive industrial leader) and Praxair (materials and process gases). He also worked as a researcher for Materials Science Institute in Italian Academy of Science and University of California at Berkeley.

    Dr. Huang received his PhD in Materials Science & Applied Surface Chemistry from University of California at Berkley and completed a management program sponsored by CSIRO/BHP in Sydney, Australia. He was the winner of IAA 2000 (Intel Achievement Award). He holds several patents in new materials, magnetic thin film head design and new polymer chemistry world wide, published papers in prestigious journals, gave seminars to universities and invited talks to international conferences. He also served as a chairman of several international conferences for semiconductor industry.

    Hans Xiao,肖汉中
    Senior Director,TEL上海
     

    Hans Xiao is a Senior Director of Tokyo Electron (Shanghai) Limited, responsible for etch business and process engineering. He was a senior staff and manager for process development and integration at Lam Research from 2001 to 2006. He also worked as a senior engineer, staff engineer, and senior staff engineer at Applied Materials from 1994 to 2001. With Applied, he experienced a variety of technologies such as Metal CVD, Dielectric CVD, Metal Etch, Dielectric Etch, and Cu Module Integration. He holds a Ph.D. degree in Materials Science and Engineering from University of Illinois at Champaign-Urbana, USA.


    Kelvin Xia
    Service & Support Manager
    Verigy, China
     

    Currently Dr. Kelvin Xia is the Service and Support Manager for Verigy in China. He took the same position in Agilent since May 2005 before Verigy was spun-off from Agilent in June 2006.

    In 1990, he received his PhD. from Tsinghua University majored in Electric Engineering with emphasizing on Microwave Technology and Electromagnetic Field Theory.

    After his PhD. study, Dr. Xia focused his research and development on Artificial Intellectual and Machine Translation for couple years. Then he entered into the semiconductor industry. Over the past thirteen years, Dr. Xia has possessed different experience in application development, technical support, sales and marketing, as well as strategic management within the industry.

    Prof. De-ren YANG
    Service & Deputy Director
    State Key Lab of Silicon Materials
    Zhejiang University
     

    After getting his Ph.D. degree in 1991, Deren Yang was a lecturer in the State Key Lab of Silicon Materials. In 1993 he worked in the Institute for Material Research at Tohoku University in Japan as a visiting researcher and then was promoted an associate professor at Zhejiang University. Since 1995, he had worked in the Institute for Experimental Physics at Technical Bergacademie University of Freiberg in Germany. In 1997 he was specially promoted a full professor at Zhejiang University. In 1998 he came back China to work in the State Key Lab of Silicon Materials. In 2000 he was promoted to be the Cheung Kong Professor by the Department of Education of China. In 2002 he won the National Science Fund for Distinguished Young Scholars.

    He and his co-workers have authored four books and over 250 research papers in international journals. He also received 24 patents. He won the Second Prize of National Natural Science in 2005 and the 9th Chinese Science and Technology Award for Young Scientist. He was also the committee members of more than 10 international conferences and has given 14 invited talks in international conferences.

     
     
    SEMI简介 | About SEMI | 联系我们 | Privacy Policy | semi.org
    Copyright © 2018 SEMI®. All rights reserved.
    沪ICP备06022522号
    沪公网安备31011502000679号
  • 各族群众乐享假日:粽叶飘香 歌舞传情 2019-08-12
  • 人民网评:涉及群众利益的事,必须“马上就办” 2019-08-12
  • 2018世界杯进入倒计时  莫斯科举行大型灯光秀 2019-07-31
  • 组图:第98届全国糖酒会开幕 异域美酒飘香全场 2019-07-12
  • 佛山通报“母女公交站身亡原因”:广告灯箱电线破损漏电 2019-07-04
  • 注意了!报考这个专业须先参加面试 2019-07-04
  • 湖州林城:多渠道搭建“双禁”宣传平台 2019-06-29
  • 西川:把自己活成一件作品西川作品 2019-06-12
  • 人生就是不断在告别,但请晚点再离开我 2019-06-12
  • 一直在提速降费 为何手机用户话费不降反升? 2019-06-09
  • 端午节 收艾草(组图) 2019-06-09
  • 梁天女儿进军电影圈 呼吁父爱的处女作《让我怎么相信你》8月上映  2019-06-08
  • 探访玉麦守边人(新时代·面孔) 2019-06-07
  • 乡村振兴,上海这些特色小镇如何亮出名片 2019-06-07
  • 政府拆迁和商业拆迁有什么不同?当时错信了奸商,懊悔知道晚了! 2019-06-06
  • 2019开奖记录开奖结果 时时走势图怎么看号 新浪体彩走势图表 河北麻将技巧 2019全年开奖记录 浙江十一选五开奖信息 北京五分彩开奖走势图 十二生肖开奖结果查询四不像 3d试机号历史对应码17500 vr重庆走势图